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The display of the latest production test technology
Date:2014-05-12    CopyFrom:    

The world's leading high-tech enterprises in Agilent recently held a number of measuring instruments, including the 2004 Shanghai international electronic equipment and Microelectronic Industry Exhibition (Nepcon) held in Wuhan,2004 electronic measuring instrument exhibition. Agilent shows the latest production of measuring instruments in the exhibition. Including the solid modeling (SSM, Solid Shape Modeling) technology of automatic optical detection of SP50/SJ50 and Agilent a new generation of non vector VTEP Test Technology (Vectorless Test EP). Gundam 325GHz measurement capability of the whole millimeter wave test solutions, to provide a full range of network analyzer component manufacturers, integrity of data service, IP service and the optical communication industry comprehensive test solution; at the same time, the traditional industry requires higher frequency range, wider bandwidth and more complex modulation technology, Agilent a full set of radar and military communication test solution; in addition, Agilent also committed to providing access to wireless communication, broadband test products,systems and solutions and provide for the Engineer RF and microwave field all test solutions, to deal with the increasingly complex technical challenges. In the high speed bus eye testing and jitter analysis technology, the embedded system of FPGA test and measurement, Bluetooth baseband signal and the pulse width modulation signalAgilent also showcased its latest achievement.

Agilent said, using the technology of SSM SP50/SJ50 automatic optical detection with AOI, is currently the industry's only lead-free solution. SSM technology provides the highest accuracy, easy defect alarm feedback ability andimproved process. The Agilent AOI solution can use the same hardware platform furnace after AOI detection and 3Dsolder paste inspection, which not only provides flexibility, customers can also save the equipment investment.

At the same time, Agilent also exhibited its new generation of the non vector VTEP testing technology. For SMT connectors, BGA and SOP packages provide solutions without vector test. According to introduction, VTEP candetect various devices including BGA and SMT connectors, PCB board of the open circuit or short circuit, theautomation of silicon (Automated Silicon Nails), nail through the boundary scan device, can also be used to test range extended to some internal node in integrated circuit.

The Agilent Nepcon also demonstrated its intelligent testing software solutions, Agilent repair tool (ART), and thequality control solution (AQT) series products. The intelligent test software solution is mainly used for the conversion from CAD to the parts of the production test link repair. The ART provides an easy to use public interface, to help manufacturers achieve a higher throughput, yield and flexibility in the repair process. Also on display products and3D X light testing equipment Agilent 5DX and online testing equipment Agilent 3070.

Agilent is communication, electronics and life sciences global leader. Company existing staff 28000 people, to provide services for more than 110 countries in the global customers. Agilent electronic instruments and systemsdivision as the core sectors of the business has been committed to the Chinese market and common development,to provide customized products and services to the market and user Chinese.


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